Paper number 1357

DRILLING OF MULTI-LAYER PRINTED WIRING BOARD OF AFRP USING CO2 LASER

Hisahiro Inoue¹, Toshiki Hirogaki², Eiich Aoyama³, Tsutao Katayama³ and Keij Ogawa⁴

1Faculty of Engineering, Osaka Prefectural University
Gakuen-cho, Sakai, Osaka, 599-8531, Japan
2School of Engineering, The University of Shiga prefecture
Hasska, Hikone, Shiga, 522-8533, Japan
3Faculty of Engineering, Doshisha University
Miyakodani,Kyoutanabe, Kyoto, 610-0394, Japan
4Murata Manufacturing Co., Ltd
Yasu,Shiga, 522-2393, Japan

Summary

The multi-layer PWB (printed wiring board) made of AFRP for laser drilling is chosen as a subject of our study. The drilling conditions of drilling the blind via holes and the quality of the drilled holes are examined using a CO2 laser source against this composite material. As a result, it is shown that there are the processing conditions which AFRP is drilled without drilling through the copper foil of the inner layer. Laser drilling is an effective method to perform the blind via holes. Additionally, it is feasible to drill the hole with promising tapers against plating for electric circuits using a laser source.

Keywords

drilling, multi-layer printed wiring board, CO2 laser, AFRP, blind via hole.